Title:
高密度電気コネクタ
Document Type and Number:
Japanese Patent JP3954111
Kind Code:
B2
Abstract:
A self-aligning, flexible high density and impedance adjusted electrical connectors for use in microelectronic systems for overcoming the problem of having electrical connection and alignment at the same time is disclosed. The connector comprises a first part (204) consisting of two metal layer structures, a first signal path (212) and a first ground path (210) covering a V-groove (202), and a second part (208) consisting of corresponding metal layers of the first part, a second signal path (224) covering an elastic bump (206) and a second signal ground plane (226) which fits into the V-groove (202). The first and the second signal paths are in contact with each other when the first and the second parts are brought together and the contact is self-aligning when put together. The electrical contact will remain despite displacement due to thermal expansion.
Inventors:
Hesselbom, Lillebroll, Fujalmar
Bodo, Yang, Peter
Bodo, Yang, Peter
Application Number:
JP52763098A
Publication Date:
August 08, 2007
Filing Date:
December 19, 1997
Export Citation:
Assignee:
Infineon Technologies AG
International Classes:
H01L21/60; H01L21/98; H01L23/498; H01L23/538; H01L23/66; H01L27/00; H01R13/648; H01L29/06; H05K3/32; H05K3/40
Domestic Patent References:
| JP1013734A | ||||
| JP7131131A | ||||
| JP8234035A | ||||
| JP2277248A |
Attorney, Agent or Firm:
Hideto Asamura
Hajime Asamura
Hayashi Zouzo
Kuniaki Shimizu
Hajime Asamura
Hayashi Zouzo
Kuniaki Shimizu