Title:
電気・電子回路に用いる接点部材の製造方法及び該製造装置
Document Type and Number:
Japanese Patent JP3966898
Kind Code:
B2
Abstract:
A method for producing contact materials being employed in electric/electronic circuits consists of a step 1-1 for supplying a spring base strip 1, a step 2-1 for supplying a noble metal wire 2, a seam welding step 3-1 for welding the metal wire 2 to the spring base strip after the spring base strip 1 and the noble metal wire 2 are held together, and a step 4-1 for winding a welded product. The method further includes a testing step 8-1 for determining a preciseness of a welded position and for determining a welded strength to peel the noble metal wire 2 from the spring base strip 1, which are performed between the seam welding step 3-1 and the winding step 4-1. Specimens for the testing step 8-1 are sampled at the beginning of and at the end of a production lot of the contact material.
Inventors:
Kasai Yoshiaki
Kiyoshi Takizawa
Kiyoshi Takizawa
Application Number:
JP2006544747A
Publication Date:
August 29, 2007
Filing Date:
November 19, 2004
Export Citation:
Assignee:
Sept One Co., Ltd.
International Classes:
H01R43/16
Domestic Patent References:
| JP9106874A | ||||
| JP6170548A | ||||
| JP2000312976A | ||||
| JP2299187A |
Attorney, Agent or Firm:
Hiroyuki Niwa
Tadao Noguchi
Tadao Noguchi