Title:
ウエハーレベル・チップサイズ・パッケージおよびその製造方法
Document Type and Number:
Japanese Patent JP3972246
Kind Code:
B2
Inventors:
Hiroshi Asami
Application Number:
JP2003001274A
Publication Date:
September 05, 2007
Filing Date:
January 07, 2003
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L23/12; H01L21/56
Domestic Patent References:
| JP2001267350A | ||||
| JP8330355A | ||||
| JP2000340696A | ||||
| JP2000228417A |
Attorney, Agent or Firm:
Yasuo Iisaka