Title:
半導体製造装置用セラミックスヒーター
Document Type and Number:
Japanese Patent JP3979264
Kind Code:
B2
Abstract:
For semiconductor manufacturing equipment, a ceramic susceptor that without occurrence of cracking in the course of heating wafers suppresses thermal radiation from the circumferential surface of a wafer placed on the ceramic susceptor, to heighten isothermal quality in the wafer face. A semiconductor-manufacturing-equipment ceramic susceptor (1) including a resistive heating element (3) in the face or interior of ceramic substrates (2a, 2b) has a wafer pocket (5) consisting of a recess that can accommodatingly carry a wafer. The angle that the perimetric inside surface and the bottom face of the wafer pocket (5) form is over 90° and 170° or less, and/or the curvature of the bottom-portion circumferential rim where the perimetric inside surface and the bottom face of the pocket join is 0.1 mm or more. A plasma electrode furthermore may be disposed in the face or interior of the ceramic substrates (2a, 2b) of the ceramic susceptor (1).
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Inventors:
Yoshifumi Kachi
Shuhei Uesugi
Hirohiko Nakata
Shuhei Uesugi
Hirohiko Nakata
Application Number:
JP2002309385A
Publication Date:
September 19, 2007
Filing Date:
October 24, 2002
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
H01L21/205; H05B3/20; C23C16/458; C23C16/46; H01L21/00; H01L21/687; H05B3/10; H05B3/12; H05B3/14; H05B3/74
Domestic Patent References:
| JP2002134484A |
Attorney, Agent or Firm:
Minoru Nakano
Mikio Yamaguchi
Hideaki Nishima
Mikio Yamaguchi
Hideaki Nishima