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Patent Searching and Data


Title:
積層基板、積層基板の製造方法、非可逆回路素子及び通信装置
Document Type and Number:
Japanese Patent JP3979355
Kind Code:
B2
Inventors:
Rikuhiro Tsunemon
Yasuhiro Nakagawa
Application Number:
JP2003200317A
Publication Date:
September 19, 2007
Filing Date:
July 23, 2003
Export Citation:
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Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01P1/36; H01P1/383; H01P11/00
Domestic Patent References:
JP2003126985A
JP9214210A
JP2000223998A
Attorney, Agent or Firm:
Takeichi Morishita