Title:
エポキシ樹脂成形材料及び素子収納型半導体パッケージ
Document Type and Number:
Japanese Patent JP3982320
Kind Code:
B2
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Inventors:
Masanobu Fujii
Hidenori Abe
Takatoshi Ikeuchi
Hidenori Abe
Takatoshi Ikeuchi
Application Number:
JP2002128671A
Publication Date:
September 26, 2007
Filing Date:
April 30, 2002
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08L63/00; C08K3/22; H01L23/06; H01L23/08
Domestic Patent References:
| JP7216196A | ||||
| JP7126492A | ||||
| JP10279813A | ||||
| JP8078558A | ||||
| JP2003160714A | ||||
| JP2002097252A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu