半導体封止用エポキシ樹脂組成物及び半導体装置

Title:

半導体封止用エポキシ樹脂組成物及び半導体装置

Document Type and Number:

Japanese Patent JP3982344

Kind Code:

B2

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Inventors:

Masashi Nakamura
Takayuki Tsuji
Hiroyuki Shiraki
Higashine Seiko

Application Number:

JP2002185006A

Publication Date:

September 26, 2007

Filing Date:

June 25, 2002

Export Citation:

Assignee:

MATSUSHITA ELECTRIC WORKS,LTD.

International Classes:

C08L63/00; C08G59/62; C08K5/5397; H01L23/29; H01L23/31

Domestic Patent References:

Attorney, Agent or Firm:

Keisei Nishikawa
Atsuo Mori

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