Title:
封止用エポキシ樹脂成形材料及び電子部品装置
Document Type and Number:
Japanese Patent JP3982505
Kind Code:
B2
Inventors:
Tendo Ichiyoshi
Haruaki Tou
Shinsuke Hagiwara
Haruaki Tou
Shinsuke Hagiwara
Application Number:
JP2004021442A
Publication Date:
September 26, 2007
Filing Date:
January 29, 2004
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08L63/00; C08G59/62; C08K3/22; C08K5/5399; H01L23/29; H01L23/31
Domestic Patent References:
| JP10259292A | ||||
| JP52153987A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu