Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP3983751
Kind Code:
B2
Inventors:
Masaya Otsuka
Application Number:
JP2004169322A
Publication Date:
September 26, 2007
Filing Date:
June 08, 2004
Export Citation:
Assignee:
株式会社リコー
International Classes:
H01L21/28; H01L21/822; H01L21/3205; H01L23/52; H01L27/04
Domestic Patent References:
| JP8097339A | ||||
| JP2004079893A |
Attorney, Agent or Firm:
Torii Hiroshi