Title:
試料研磨装置、試料研磨方法及び研磨パッド
Document Type and Number:
Japanese Patent JP3992092
Kind Code:
B2
Abstract:
A sample suck pad (chuck) made of resin is stuck and fixed onto the entirety of the lower surface of a chuck base, with an adhesive layer (rubber adhesive double coated tape). The adhesive layer includes a rubber-based adhesive material and has the shearing adhesive strength of 1.96 MPa (20 kgf/cm2). The outer periphery of the adhesive layer is covered with a sealing layer so that the contact of the adhesive layer with the outside is blocked off. A sample is sucked and held on the lower surface of the sample suck pad and this sample is pressed onto a polishing pad, which is fixed on a platen, so as to be polished.
Inventors:
Akihiko Saguchi
Wataru Takahashi
Wataru Takahashi
Application Number:
JP2000107194A
Publication Date:
October 17, 2007
Filing Date:
April 07, 2000
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B24B37/30; H01L21/304
Domestic Patent References:
| JP11188617A | ||||
| JP62153047U |
Attorney, Agent or Firm:
Nobuo Kono