Title:
MEMS素子とその製造方法、回折型MEMS素子
Document Type and Number:
Japanese Patent JP3994885
Kind Code:
B2
Abstract:
The present invention provides a MEMS device in which a warp that is deformation of a beam is reduced and which aims to improve the characteristic thereof, a method for manufacturing the MEMS device and a diffraction-type MEMS device. The MEMS device of the present invention includes a substrate-side electrode and a beam driven by a static electricity generated between the substrate-side and the beam, in which the beam is formed of a plurality of thin films including a driving-side electrode and is provided with deformation prevention means for preventing the deformation of the beam due to the warp of thin films caused by film stress. The diffraction-type MEMS device of the present invention is configured such that in the above-described configuration the substrate-side electrode is made common and a plurality of beams are provided independently to each other so as to be opposed to the substrate electrode.
Inventors:
Koji Nanbata
Application Number:
JP2003038696A
Publication Date:
October 24, 2007
Filing Date:
February 17, 2003
Export Citation:
Assignee:
ソニー株式会社
International Classes:
B81B3/00; B81C1/00; G02B26/08; G02B6/34
Domestic Patent References:
| JP52084158A | ||||
| JP2002237245A | ||||
| JP2002214550A | ||||
| JP2002052500A | ||||
| JP2002207182A |
Foreign References:
| WO2001014842A1 |
Attorney, Agent or Firm:
Yoshitsuno Kakuda
Hironobu Isoyama
Hironobu Isoyama