Title:
電子素子用の表面実装ベース
Document Type and Number:
Japanese Patent JP3996904
Kind Code:
B2
Abstract:
A surface-mount base for an electronic element includes: an insulative supporting member having a through hole; a plurality of lead terminals each having an element connecting terminal, a lead portion and a mounting terminal, the lead terminals being mounted to the supporting member with the lead portions passing through the through hole so that the element connecting terminals face a top face side of the supporting member and the mounting terminals face a bottom face side of the supporting member; and a sealing glass that is charged in the through hole of the supporting member for sealing the lead terminals in the through hole. The supporting member is composed of a supporting frame having an outer wall that defines the through hole, and at least one of the lead portion and the mounting terminal of each lead terminal has a shape and a dimension that cause a pressure against at least one of an inner face and an outer face of the outer wall, whereby the lead terminals are held on the supporting frame. The lead terminal is positioned on the supporting member while suppressing a disconnection or a rattle.
More Like This:
| JP3825310 | PACKAGE FOR SEMICONDUCTOR ELEMENT |
| JP2005353826 | CERAMIC PACKAGE |
| JPS61240643 | MOUNTING PART FOR MULTILAYER HYBRID INTEGRATED CIRCUIT |
Inventors:
Hiroshi Nakai
Application Number:
JP2004018445A
Publication Date:
October 24, 2007
Filing Date:
January 27, 2004
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L23/04; H01L41/09; H01G4/00; H01L41/18; H01R9/16; H01R12/00; H01R43/20; H03H9/05; H03H9/10; H05K1/11; H05K1/14; H05K3/32
Domestic Patent References:
| JP2000012997A | ||||
| JP2002009360A | ||||
| JP2001217477A | ||||
| JP2001196488A | ||||
| JP2006066377A |
Attorney, Agent or Firm:
Ikeuchi, Sato & Partners