Title:
超小型電子機械構造およびその製造方法
Document Type and Number:
Japanese Patent JP3998266
Kind Code:
B2
Abstract:
The microelectromechanical device (10) comprises a cantilevered beam (22) positioned above, and free to move relative to, a substrate (24). The beam carries several conductors insulated from one another. A tip (28) is positioned on the beam, in electrical contact with one of the conductors. The beam can move in one direction parallel to the plane of the substrate, and in a direction perpendicular to the plane of the substrate.
Inventors:
Carley, ell, richard
Reed, Michael, Elle.
Fedder, Gary, Kay.
Sansanam, Suresh
Reed, Michael, Elle.
Fedder, Gary, Kay.
Sansanam, Suresh
Application Number:
JP50691697A
Publication Date:
October 24, 2007
Filing Date:
July 19, 1996
Export Citation:
Assignee:
CARNEGIE MELLON UNIVERSITY
International Classes:
G01B21/30; G11B9/14; B62D57/00; B81B3/00; B81B5/00; B81B7/02; B81C3/00; G01N37/00; G01Q60/16; G01Q80/00; G11B9/00; G11B9/04; H02N1/00; G11B5/00
Domestic Patent References:
| JP5018741A | ||||
| JP61206148A |
Attorney, Agent or Firm:
Shinichi Ogawa
Takashi Noguchi
Kazuhiko Saishita
Takashi Noguchi
Kazuhiko Saishita