Title:
多層配線基板、この多層配線基板を複数枚組み合わせた基板構造及びこれらの使用方法
Document Type and Number:
Japanese Patent JP4003512
Kind Code:
B2
Inventors:
Kenji Koyama
Application Number:
JP2002102246A
Publication Date:
November 07, 2007
Filing Date:
April 04, 2002
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K3/46
Domestic Patent References:
| JP2000252609A | ||||
| JP2001230554A |
Attorney, Agent or Firm:
Kazuhide Okada