Title:
フォトレジスト用高分子及びフォトレジスト用樹脂組成物
Document Type and Number:
Japanese Patent JP4003876
Kind Code:
B2
Abstract:
A polymeric compound for photoresist of the invention includes at least one monomer unit represented by following Formula (I): wherein R<1>, R<2>, R<3>, R<4> and R<5> are the same or different and are each a hydrogen atom or a methyl group; m, p and q each denote an integer of from 0 to 2; and n denotes 0 or 1, where the hydroxyl group and carbonyloxy group extending from a principle chain in the formula are independently combined with either of two carbon atoms on the far-left portion of the rings. By using the polymeric compound for photoresist as a base of a photoresist, the resulting photoresist exhibits well-rounded adhesion to substrates and resistance to etching.
Inventors:
Katsunori Funaki
Seiharu Tsutsumi
Keizo Inoue
Tomoko Adachi
Seiharu Tsutsumi
Keizo Inoue
Tomoko Adachi
Application Number:
JP2002549747A
Publication Date:
November 07, 2007
Filing Date:
December 11, 2001
Export Citation:
Assignee:
Daicel Chemical Industry Co., Ltd.
International Classes:
C08F220/28; G03F7/039
Domestic Patent References:
| JP2000122294A | ||||
| JP10207069A | ||||
| JP2000159758A | ||||
| JP2001242627A | ||||
| JP2002234882A |
Attorney, Agent or Firm:
Yukihisa Goto