Title:
ポリイミドフィルムおよび積層体
Document Type and Number:
Japanese Patent JP4006999
Kind Code:
B2
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Inventors:
Hideo Ozawa
Shigeru Yamamoto
Shigeru Yamamoto
Application Number:
JP2001391387A
Publication Date:
November 14, 2007
Filing Date:
December 25, 2001
Export Citation:
Assignee:
Ube Industries,Ltd.
International Classes:
B32B27/34; C08G73/10
Domestic Patent References:
| JP2002240193A | ||||
| JP10138318A | ||||
| JP11154314A | ||||
| JP4032289A | ||||
| JP6275928A | ||||
| JP63193927A |