Title:
ポリアミド系樹脂積層フィルム
Document Type and Number:
Japanese Patent JP4014697
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a laminate film having excellent mechanical properties, gas barrier properties and pinhole resistance and containing an aliphatic polyamide film layer. SOLUTION: The laminated film comprises at least two or more layers of a polyamide resin composition layer containing (A) 85 to 99 pts.wt. of aliphatic polyamide, (B) 1 to 15 pts.wt. of potassium ionomer of ethylene-unsaturated carboxylate copolymer and (C) 0.12 to 1 pt.wt. of polyhydric alcohol compound (e.g. polyoxyalkylenepolyol, glycerol), and other thermoplastic resin layer (particularly, olefin polymer layer).
Inventors:
Hitoshi Tateno
Yoshitaka Hironaka
Yoshitaka Hironaka
Application Number:
JP23565697A
Publication Date:
November 28, 2007
Filing Date:
September 01, 1997
Export Citation:
Assignee:
Mitsui DuPont Polychemical Co., Ltd.
International Classes:
B32B27/34; C08K5/05; C08L33/02; C08L77/00
Domestic Patent References:
| JP8267671A | ||||
| JP6091824A | ||||
| JP7216178A | ||||
| JP5064866A | ||||
| JP6136157A | ||||
| JP5230365A | ||||
| JP5057855A | ||||
| JP6255054A | ||||
| JP7144395A | ||||
| JP9193307A | ||||
| JP4246442A | ||||
| JP11060944A |
Attorney, Agent or Firm:
Kazu Yamaguchi