Title:
電子回路用部材及びその製造方法並びに電子部品
Document Type and Number:
Japanese Patent JP4015023
Kind Code:
B2
Abstract:
A member (12A) for use in an electronic circuit has a thermally conductive layer (22) mounted on a heat sink (20). The thermally conductive layer (22) comprises an insulating substrate (24), a first joint member (26) joining the insulating substrate (24) to the heat sink (20) and containing an active element, a second joint member (28) disposed on the insulating substrate (24), and an electrode (30) disposed on the second joint member (28). The insulating substrate (24) comprises an AlN layer or an Si3N4 layer. Each of the first and second joint members (26, 28) is made of a hard brazing material containing an active element. The heat sink (20) is made of an SiC/Cu composite material or a C/Cu composite material.
Inventors:
Shuhei Ishikawa
Takahiro Ishikawa
Masahiro Kuda
Ken Suzuki
Takahiro Ishikawa
Masahiro Kuda
Ken Suzuki
Application Number:
JP2002566549A
Publication Date:
November 28, 2007
Filing Date:
December 19, 2001
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
H01L23/373; H05K1/03; H05K3/00; H05K3/38
Domestic Patent References:
| JP3242385A | ||||
| JP11274383A | ||||
| JP2000281468A | ||||
| JP2000174183A |
Attorney, Agent or Firm:
Takehiro Chiba
Toshiyuki Miyadera
Toshiyuki Miyadera