Title:
樹脂組成物、半導体パッケージ、接着フィルムおよび樹脂ワニス
Document Type and Number:
Japanese Patent JP4015668
Kind Code:
B2
Inventors:
Yutaka Takahashi
Application Number:
JP2005160356A
Publication Date:
November 28, 2007
Filing Date:
May 31, 2005
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C09J163/10; C08F290/14; C09J7/00; C09J7/02; C09J163/00; H01L21/52
Domestic Patent References:
| JP2002224886A | ||||
| JP2003297876A | ||||
| JP2003309131A | ||||
| JP9100450A |
Attorney, Agent or Firm:
Shinji Hayami
Koji Sato
Koji Sato