Title:
多層配線基板
Document Type and Number:
Japanese Patent JP4022102
Kind Code:
B2
Inventors:
Ochiai Kenso
Morishige
Morishige
Application Number:
JP2002171910A
Publication Date:
December 12, 2007
Filing Date:
June 12, 2002
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K3/46; H01L23/13
Domestic Patent References:
| JP2000244087A | ||||
| JP8181441A | ||||
| JP11031754A |