Title:
半導体用粘接着シートおよび半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4027332
Kind Code:
B2
Abstract:
Disclosed herein is a hardenable pressure-sensitive adhesive sheet enabling production of a semiconductor device of high reliability while preventing the occurrence of package cracking and other failures. Also disclosed is a process for producing a semiconductor device using the hardenable pressure-sensitive adhesive sheet. A hardenable pressure-sensitive adhesive sheet of the invention has
a hardenable pressure-sensitive adhesive layer comprising a pressure-sensitive component (A) and an epoxy resin (B), wherein the hardenable pressure-sensitive adhesive layer after thermal curing has a storage modulus of 1.0×10 7 Pa or below at 100°C and 1.0×10 5 Pa or above at 160°C.
Inventors:
Naoki Saeki
Osamu Yamazaki
Akie Nakagishi
Osamu Yamazaki
Akie Nakagishi
Application Number:
JP2004080701A
Publication Date:
December 26, 2007
Filing Date:
March 19, 2004
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
H01L21/52; C09J4/02; C09J7/22; C09J7/35; C09J7/38; C09J133/00; C09J163/00; H01L21/00; H01L21/68
Domestic Patent References:
| JP2003055632A | ||||
| JP2002226800A | ||||
| JP2004083602A | ||||
| JP2002285109A | ||||
| JP2002158276A |
Attorney, Agent or Firm:
Shunichiro Suzuki
Koji Makimura
Chihata Takahata
Toru Suzuki
Koji Makimura
Chihata Takahata
Toru Suzuki