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Title:
半導体素子
Document Type and Number:
Japanese Patent JP4038389
Kind Code:
B2
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Inventors:
Shinji Fujimoto
Yoshiya Asakura
Application Number:
JP2002133977A
Publication Date:
January 23, 2008
Filing Date:
May 09, 2002
Export Citation:
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Assignee:
Nippon Inter Co., Ltd.
International Classes:
H01L29/00; H01L29/861; H01L29/06; H01L29/739; H01L29/78
Attorney, Agent or Firm:
Hiroshi Arafune
Yoshio Arafune



 
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