Title:
ペルチェ素子による温度制御装置
Document Type and Number:
Japanese Patent JP4050627
Kind Code:
B2
Abstract:
There are provided a device for controlling temperature by Peltier element and a method for controlling temperature by the same, wherein the structure of the device can be simplified, the cost making the device can be reduced and an accuracy of the temperature control of a contact plane based on the detected temperature value with a temperature sensor can be improved by capacitating insulation for a Peltier element and related elements without providing a vacuum case and related elements for encapsulating a Peltier element and related elements. In a device for controlling temperature by Peltier element, wherein a temperature-controlled body is rapidly cooled or heated by Peltier effect generated by contacting the temperature-controlled body with the contact plane connected to a conductive body and by applying a direct current voltage between the Peltier element and the electrode-cum-heat-sink, a device for controlling temperature by Peltier element is characterized in that there are provided an end cover which covers the conductive body, the Peltier element and a whole of the electrode-cum-heat-sink or a part of the conductive body side and which forms a contact plane; a gas layer sealed in a space formed inside the cover; and an insulating layer comprising insulating material in the space formed inside the cover between the conductive body and the gas layer.
Inventors:
Shigenao Enyama
Katsumi Fujima
Yoshikawa Asahi
Shuji Fukano
Katsumi Fujima
Yoshikawa Asahi
Shuji Fukano
Application Number:
JP2003021193A
Publication Date:
February 20, 2008
Filing Date:
January 29, 2003
Export Citation:
Assignee:
Shigenao Enyama
Maekawa Manufacturing Co., Ltd.
Maekawa Manufacturing Co., Ltd.
International Classes:
A61F7/00; F25B21/02; A61B18/02
Domestic Patent References:
| JP2002177296A | ||||
| JP1153148A |
Attorney, Agent or Firm:
Masahisa Takahashi
Hisamaru Hanada
Hisamaru Hanada