Title:
半導体装置の作製方法
Document Type and Number:
Japanese Patent JP4050902
Kind Code:
B2
Inventors:
Shunpei Yamazaki
Application Number:
JP2001401933A
Publication Date:
February 20, 2008
Filing Date:
December 28, 2001
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
C23C16/46; H01L21/26; H01L21/20; H01L21/306; H01L21/336; H01L29/786
Domestic Patent References:
| JP5206048A | ||||
| JP974201A | ||||
| JP61251128A | ||||
| JP1070077A |
Attorney, Agent or Firm:
Nobuyuki Watanabe