Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP4057261
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method that can achieve a stable signal transmission in the connection between a semiconductor element for handling a high-frequency signal and a circuit board. SOLUTION: The semiconductor device comprises a first bump 115a, and a second bump 115b for forming clearance 118 for capacity generation that allows a capacitance component for securing stability in the characteristics of a semiconductor element 111 to be generated, thus stably transmitting signals in the connection between the semiconductor element and a circuit board 112 by the capacitance component even in a semiconductor device requiring high- speed, high-frequency operation especially. Further, a conventional capacitor is not required, thus improving the packaging properties of the semiconductor element to the circuit board, and reducing the cost.
Inventors:
Kenichi Yamamoto
Kazuya Gokawa
Kazuyuki Tomita
Kazuya Gokawa
Kazuyuki Tomita
Application Number:
JP2001242301A
Publication Date:
March 05, 2008
Filing Date:
August 09, 2001
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60
Domestic Patent References:
| JP6224257A | ||||
| JP10189660A |
Attorney, Agent or Firm:
Aoyama Aoi
Mitsuo Wada
Mitsuo Wada