Title:
弾性表面波装置の製造方法
Document Type and Number:
Japanese Patent JP4057907
Kind Code:
B2
Abstract:
A surface acoustic wave device used as a branching filter and the like in, for example, a mobile communications field to handle high frequencies of about several GHz is manufacturable by forming a metal film on a wafer-like piezoelectric substrate and selectively removing the metal film to form comb-teeth-shaped metal electrodes. The metal film is partly formed in two or more film-forming modes involving different in-wafer-plane film-forming-velocity distributions, and the remaining part thereof is formed in a fixed film-forming mode. An in-wafer-plane film-thickness distribution of a part of the metal film is precisely controllable. Forming the remaining part of the metal film precisely controls the final thickness of the metal film.
Inventors:
Toshiyuki Takagi
Application Number:
JP2002505752A
Publication Date:
March 05, 2008
Filing Date:
June 07, 2001
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H03H3/08; C23C14/35
Domestic Patent References:
| JP3208888A | ||||
| JP2000212740A | ||||
| JP9312268A |
Attorney, Agent or Firm:
Hidekazu Miyoshi