Title:
発光ダイオードおよびその製造方法並びに発光ダイオードの電気配線基板への搭載方法
Document Type and Number:
Japanese Patent JP4061005
Kind Code:
B2
Abstract:
There is provided an LED that can prevent the dissolution and separation of electrodes due to etching in the manufacturing stage and has a high light emission efficiency even when horizontally mounted as well as a method for manufacturing the LED. In a light-emitting diode 100 which is cut from a wafer by dicing and in which a positive electrode 4 and a negative electrode 3 are formed parallel to a pn junction plane 20, the positive electrode 4 provided by a p-side ohmic contact metal layer 41 formed on a surface of a p-type semiconductor layer (p-type GaN layer 2) and a p-side electrode metal layer 42 made of an alloy including gold and nickel, while the negative electrode 3 is provided by an n-side ohmic contact metal layer 31 formed on a surface of an n-type semiconductor layer 1 and an n-side electrode metal layer 32 made of an alloy including gold and nickel. The side surface 7 of a light-emitting diode chip that is brought in contact with a dicing blade is etched by an acid solution.
Inventors:
Kiyohisa Ota
Application Number:
JP2000030420A
Publication Date:
March 12, 2008
Filing Date:
February 08, 2000
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L33/40; H01L33/32; H01L33/62; H05K3/34
Domestic Patent References:
| JP10303460A | ||||
| JP10270753A | ||||
| JP53026590A | ||||
| JP57049284A |
Attorney, Agent or Firm:
Aoyama Aoi
Hiroshi Yamazaki
Hiroshi Yamazaki