Title:
樹脂ブロック絶縁システム
Document Type and Number:
Japanese Patent JP4064045
Kind Code:
B2
Abstract:
A method for manufacture of a resin block includes setting high-voltage and low-voltage side conductors in dies, assembling the dies, extruding resin so as to form a resin block having the high-voltage side conductor and the low-voltage side conductor embedded therein, cooling the molded resin block, and taking out the molded resin block from the dies.
Inventors:
Ryozo Takeuchi
Junpei Kusugawa
Koji Obata
Junpei Kusugawa
Koji Obata
Application Number:
JP2000265842A
Publication Date:
March 19, 2008
Filing Date:
September 01, 2000
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01B17/64; H01B17/66
Domestic Patent References:
| JP7037701A | ||||
| JP2015522A |
Attorney, Agent or Firm:
Polaire Patent Business Corporation
Katsuo Ogawa
Kyosuke Tanaka
Takashi Sasaki
Katsuo Ogawa
Kyosuke Tanaka
Takashi Sasaki
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