Title:
ポジ型感光性エポキシ樹脂組成物およびそれを用いるプリント回路板
Document Type and Number:
Japanese Patent JP4071106
Kind Code:
B2
Abstract:
A printed circuit board comprising an insulating layer prepared with the aid of a positive type photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule; (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent, and (d) a photosensitive acid generator.
Inventors:
Yasuaki Sugano
Koji Nojima
Koji Nojima
Application Number:
JP2002542943A
Publication Date:
April 02, 2008
Filing Date:
November 06, 2001
Export Citation:
Assignee:
Huntsman Advanced Materials Co., Ltd.
International Classes:
G03F7/004; C08G59/62; C08L63/00; C08L63/02; G03F7/032; G03F7/038; G03F7/039; H05K1/03; H05K3/46; H05K3/28
Domestic Patent References:
| JP11343398A | ||||
| JP11001547A | ||||
| JP9040751A |
Attorney, Agent or Firm:
Hajime Tsukuni
Fumio Shinoda
Fumio Shinoda