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Title:
空調用ヒートポンプ回路
Document Type and Number:
Japanese Patent JP4075072
Kind Code:
B2
Abstract:

To provide a heat pump circuit for air conditioning with a simplified structure miniaturizable, facilitating piping work or the like, reducing costs, and facilitating control.

The heat pump circuit is provided with at least a heat source side heat exchanger 1, a plurality of air supply side heat exchangers 2, a compressor 3, an expansion valve 4, a low pressure liquid pipe A, a high pressure liquid pipe B, a low pressure gas pipe C, and a high pressure gas pipe D. The compressor 3 is connected to the high pressure gas pipe D and the low pressure gas pipe C, one of a refrigerant outlet or inlet of the heat source side heat exchanger 1 is connected to the high pressure gas pipe D and the low pressure gas pipe C such that a change-over can be freely carried out, another of the refrigerant outlet or inlet of the heat source side heat exchanger 1 is connected to the high pressure liquid pipe B and the low pressure liquid pipe A such that a change-over can be freely carried out, one of a refrigerant outlet or inlet of each air supply side heat exchanger 2 is connected to the high pressure gas pipe D and the low pressure gas pipe C such that a change-over can be freely carried out, another of the refrigerant outlet or inlet of each air supply side heat exchanger 2 is connected to the high pressure liquid pipe B and the low pressure liquid pipe A such that a change-over can be freely carried out, and the high pressure liquid pipe B and the low pressure liquid pipe A are connected via the expansion valve 4.

COPYRIGHT: (C)2006,JPO&NCIPI


Inventors:
Katsuhiro Urano
Application Number:
JP2005042089A
Publication Date:
April 16, 2008
Filing Date:
February 18, 2005
Export Citation:
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Assignee:
Kimura Koki Co., Ltd.
International Classes:
F25B41/04; F25B5/02
Domestic Patent References:
JP2146474A
JP2003130482A
JP5215427A
JP2003279189A
JP2208462A
JP61110859A