To solve the problem that it is difficult to make a crystal oscillator smaller than 2 mm and thinner than 0.3 mm although miniaturization and cost reduction are desired since the diaphragms of the crystal oscillator are sealed in a metal container or a ceramic container at present, stress is applied due to the difference of thermal expansion coefficients and temperature characteristics are influenced since the materials of a package and the oscillator are different and productivity worsens as the miniaturization progresses since the diaphragms are assembled in the container one by one in the conventional manufacturing method.

A crystal diaphragm is interposed between two upper and lower crystal thin plates and sealed with an adhesive seal material showing little gas emission. Many oscillators are simultaneously formed by using three large crystal wafer thin plates corresponding to a plurality of oscillators and after that, they are divided into individual oscillators.

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