Title:
樹脂モールド品の製造方法
Document Type and Number:
Japanese Patent JP4083136
Kind Code:
B2
Abstract:
To obtain a method for producing a resin molding which can strengthen the adhesion of an insulating layer interface.
The method includes an immersion process in which the main circuit member 14 of a switchgear is immersed in a first liquid epoxy resin, and an insulating layer 17 is formed around the main circuit member 14 and a mold casting process in which after the main circuit member 14 with the insulating layer 17 formed is set in a mold, a second liquid epoxy resin having a dielectric constant smaller than that of the first epoxy resin is injected into the mold and cured to form two insulating layers 17 and 18. The insulating layer 17 immediately after being set in the mold is gelatinized.
COPYRIGHT: (C)2006,JPO&NCIPI
Inventors:
Satoshi Makishima
Toshio Shimizu
Susumu Kinoshita
Satoshi Shioiri
Masaru Miyakawa
Osamu Sakaguchi
Junichi Sato
Toshihisa Saito
Toshio Shimizu
Susumu Kinoshita
Satoshi Shioiri
Masaru Miyakawa
Osamu Sakaguchi
Junichi Sato
Toshihisa Saito
Application Number:
JP2004084499A
Publication Date:
April 30, 2008
Filing Date:
March 23, 2004
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
B29C39/10; B29K63/00; B29L31/34
Domestic Patent References:
| JP11262120A | ||||
| JP5315126A | ||||
| JP7214576A | ||||
| JP11012344A | ||||
| JP9124837A | ||||
| JP2001286018A |
Attorney, Agent or Firm:
Hiroshi Horiguchi