Title:
積層型電子部品
Document Type and Number:
Japanese Patent JP4089726
Kind Code:
B2
Inventors:
Takahiro Higashi
Application Number:
JP2005513253A
Publication Date:
May 28, 2008
Filing Date:
July 28, 2004
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G4/12; H01G4/232; H01G4/30; H01G4/35; H01G4/38
Domestic Patent References:
JP57175427U | ||||
JP6275463A | ||||
JP11214256A | ||||
JP64066916A | ||||
JP61129322U | ||||
JP58095032U |
Attorney, Agent or Firm:
Masaaki Koshiba