半導体チップ用セキュリティーデバイス

Title:

半導体チップ用セキュリティーデバイス

Document Type and Number:

Japanese Patent JP4093610

Kind Code:

B2

Abstract:

The apparatus (20) and a protected semiconductor (10) are placed opposite each other with communication points (30) between them. The piece is made with the ability to measure the various resistances across the resin (40) and to determine the encrypting key to be communicated to the protected semiconductor. The resistances are compared to establish a resistive key which may be used in combination with a secondary key held in a non-volatile memory of the protective piece. Alternatively, the piece has its own list of resistances which are the only ones of those measured that are used to determine the resistive key.

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Inventors:

Vincent Regal

Application Number:

JP7809597A

Publication Date:

June 04, 2008

Filing Date:

March 28, 1997

Export Citation:

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Assignee:

Schlumberger Andustrie

International Classes:

H01L21/822; H01L27/04; G06K17/00; G06K19/073; G06K19/077; H01L23/58; H04L9/10

Domestic Patent References:

JP63076095A

Attorney, Agent or Firm:

Minoru Nakamura
Fumiaki Otsuka
Shishido Kaichi
Hideto Takeuchi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo

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