Title:
加熱システム
Document Type and Number:
Japanese Patent JP4094960
Kind Code:
B2
Abstract:
A heating system employs a ceramic substrate and a resistive layer. The resistive layer includes a thermally stable resin, which is filled with a conductive material. A method of manufacturing such a heating system involves a provision of a ceramic substrate and an application of a resistive layer on the substrate. In the method, the resistive layer comprises includes a thermally stable resin, which is filled with a conductive material. Before application of the resistive layer, an adhesion promotor is applied on the ceramic substrate.
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Inventors:
Van der Woderene H
Application Number:
JP2002582664A
Publication Date:
June 04, 2008
Filing Date:
April 09, 2002
Export Citation:
Assignee:
Koninklijke Philips Electronics N.V.
International Classes:
H05B3/14; H05B3/16; H05B3/20; H05B3/26; H05B3/68; H05B3/74
Domestic Patent References:
| JP2242581A | ||||
| JP10199663A | ||||
| JP2000252046A | ||||
| JP58071586A |
Attorney, Agent or Firm:
Susumu Tsugaru
Akihiko Miyazaki
Akihiko Miyazaki