Title:
半導電性シームレスベルト及びその製造方法
Document Type and Number:
Japanese Patent JP4115623
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductive seamless belt molded only by an injection molding method so as to have prescribed thickness, requiring no grinding process, having no grinding mark, characterized by that the irregularity of electric resistance as a whole is below 10 in the max/min ratio of vol. resistivity, based on NBR and reduced in the change of electric resistance caused by fluctuations of an environmental condition, especially, humidity and a method for producing the same. SOLUTION: A semiconductive seamless belt having rubbery elasticity has a peripheral length of 150 mm or more, a width of 210-450 mm, a thickness of 0.3-3.0 mm and vol. resistivity of 108-1012 Ω.cm. and is molded by an injection molding method wherein a raw material rubber compsn. based on acrylonitrile/ butadiene rubber (NBR) is injected in a mold having a cavity formed by a seamless double cylinder mold from one end thereof and grinding finish in the thickness direction of the belt is not applied.
Inventors:
Kimihiro Watanabe
Minoru Matsumura
Seiji Tamura
Minoru Matsumura
Seiji Tamura
Application Number:
JP11631199A
Publication Date:
July 09, 2008
Filing Date:
April 23, 1999
Export Citation:
Assignee:
TOYO TIRE & RUBBER CO.,LTD.
International Classes:
B29D29/00; C08K3/04; C08K3/36; C08L9/02; C08L23/02; C08L27/06; F16G1/06; G03G15/16; B29K9/00; B29K27/06
Domestic Patent References:
| JP10133488A | ||||
| JP8073661A | ||||
| JP10154416A | ||||
| JP9111026A |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office
Yuzo Ozaki
Koichi Kajisaki
Toshihiko Taniguchi
Kazuto Muronozono
Yuzo Ozaki
Koichi Kajisaki
Toshihiko Taniguchi
Kazuto Muronozono