Title:
木質セメント板の製造方法
Document Type and Number:
Japanese Patent JP4119086
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a production process for a cemented wood board which has excellent adhesion to a coating film and remarkably improved dimensional stability and, in which no microcrack is caused, even when the board contains mica. SOLUTION: This production process comprises preparing a raw material mixture that consists essentially of a wood reinforcing material and a cement- based inorganic material and also contains powdery mica which has a >=150 μm average particle size and has an aspect ratio (length/thickness) of >=65, spraying the raw material mixture on a plate to form a mat, and clamping the mat and subjecting the clamped mat to autoclave curing at >=60 deg.C, in the presence of water.
Inventors:
Kawai Hidenori
Application Number:
JP2000388658A
Publication Date:
July 16, 2008
Filing Date:
December 21, 2000
Export Citation:
Assignee:
Nichiha Corporation
International Classes:
B32B13/10; C04B28/18; B28B1/52; B28B11/24; C04B14/20; C04B28/02; C04B40/02; C04B41/62; C04B41/65; C04B16/02; C04B18/26; C04B111/20
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