Title:
樹脂封止型半導体装置
Document Type and Number:
Japanese Patent JP4120101
Kind Code:
B2
Inventors:
Takenaka Hisagi
Shinichi Hirose
Shinichi Hirose
Application Number:
JP19775699A
Publication Date:
July 16, 2008
Filing Date:
July 12, 1999
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L23/29; H01L21/56; H01L23/28; H01L23/50
Domestic Patent References:
| JP6310634A | ||||
| JP11121654A | ||||
| JP53126275A | ||||
| JP8055935A | ||||
| JP52042066U |
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Fumihiro Mizuno
Takahiro Miura
Fumihiro Mizuno