Title:
封止用基板の取り付け方法及びその取り付け装置並びに表示装置の製造方法及びその製造装置
Document Type and Number:
Japanese Patent JP4123339
Kind Code:
B2
Abstract:
To smoothly attach a sealing board.
(a) One of a plurality of sealing boards 30 is carried from a preparing section 40 to a direction correcting section 50. (b) The direction of one sealing board 30 is corrected in the direction correcting section 50. (c) One sealing board 30 is carried from the direction correcting section 50 to an attaching section 60. (d) One sealing board 30 is attached so as to seal one of a plurality of objects to be sealed 102 in the attaching section 60. Processes from (a) to (d) are repeated a more than once. At least a part of the process (c) in a certain cycle is simultaneously performed with at least a part of the process (a) in the succeeding cycle.
COPYRIGHT: (C)2003,JPO
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Inventors:
Kenji Hayashi
Application Number:
JP2002044933A
Publication Date:
July 23, 2008
Filing Date:
February 21, 2002
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L23/02; G09F9/00; H01L51/50; H05B33/04; H05B33/10; H05B33/14
Domestic Patent References:
| JP2000030858A | ||||
| JP2001290117A | ||||
| JP4010443A | ||||
| JP11067879A | ||||
| JP9096822A |
Attorney, Agent or Firm:
Yukio Fuse
Mitsue Obuchi
Mitsue Obuchi
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