Title:
電子機器の冷却構造
Document Type and Number:
Japanese Patent JP4126046
Kind Code:
B2
Abstract:
A cooling structure for electronic equipment is designed for cooling a heat-generating body ( 2 a) disposed inside a case ( 20 ) by recovering heat generated by the heat-generating body ( 2 a) and dissipating the heat to the outside of the case ( 20 ). The cooling structure includes a heat-receiving section ( 4 ) for recovering heat generated in the heat-generating body ( 2 a), a thermally insulated space ( 6 ) provided with an air inflow orifice ( 42 a) and an air outflow orifice ( 42 b) and thermally insulated from the heat-generating body ( 2 a) and heat-receiving section ( 4 ) by a thermally insulating member ( 40 ), a heat-dissipating section ( 7 ) provided inside the thermally insulated space ( 6 ), a heat transfer member ( 5 ) for transferring the heat recovered in the heat-receiving section ( 4 ) to the heat-dissipating section ( 7 ), and a fan ( 22 ) for generating forcibly an air flow in the thermally insulated space ( 6 ). The heat generated by the heat-generating body ( 2 a) is transferred to the heat-dissipating section ( 7 ) via the heat-receiving section ( 4 ) and heat transfer member ( 5 ) and dissipated in a concentrated fashion by using the fan ( 22 ) inside the thermally insulated space ( 6 ).
Inventors:
Minoru Ishinabe
Hiroki Uchida
Tokuhira Hideshi
Hitoshi Date
Wataru Tanaka
Hiroki Uchida
Tokuhira Hideshi
Hitoshi Date
Wataru Tanaka
Application Number:
JP2004569347A
Publication Date:
July 30, 2008
Filing Date:
March 12, 2003
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K7/20; F25B21/02; F28D15/00; F28D15/02; F28F3/12; G06F1/16; G06F1/20; H01L23/467
Domestic Patent References:
| JP11202978A | ||||
| JP8111483A | ||||
| JP2000165077A | ||||
| JP2000304293A | ||||
| JP2942468B2 | ||||
| JP2004252741A | ||||
| JP2001134345A | ||||
| JP11512853A |
Attorney, Agent or Firm:
Minoru Yoshida
Tatsuya Tanaka
Tatsuya Tanaka