To provide a superconductive circuit device capable of preventing magnetic flux to a superconductive element without providing a through-hole in a ground plane film.
In the superconductive circuit device having a superconductive ground plane film, a region having a thickness less than the film thickness and exhibiting no superconductivity is formed in the thickness direction of a partial region of the superconductive ground plane film. More specifically, the ground plane film 1 is subjected to FIB processing (Ga ion irradiation) to remove a part of the film to make a structure having a recess. The depth of the recess is 6-90%, preferably 20-90% of the original film thickness. A part of the ground plane film may also be changed into a region exhibiting no superconductivity by diffusing a dopant or by injecting ions using ion irradiation.
COPYRIGHT: (C)2004,JPO
Seiji Adachi
Keiichi Tanabe
| JP58073172A | ||||
| JP60083385A | ||||
| JP57068005A |
Norio Kagami
Hidetake Komatsu
Jun Komatsu