Title:
高配線能力を有する高密度マイクロビア基板
Document Type and Number:
Japanese Patent JP4143592
Kind Code:
B2
Abstract:
The density of plated thru holes in a glass fiber based chip carrier is increased by off-setting holes to positions in which fibers from adjacent holes will not connect. Elongated strip zones or regions having a width approximately the diameter of the holes and running along orthogonal columns and rows of holes, parallel to the direction of fibers, define regions of fibers that can possibly cause shorting between holes. Rotating a conventional X-Y grid pattern of equidistant holes so as to position, for example, alternate holes in one direction between the elongated strip zones running in the opposite direction significantly increases the distance between holes along the elongated strip zones running in each direction. The holes are positioned between elongated strip zones with sufficient clearance to compensate for variations in the linear path of fibers.
Inventors:
Kazumasa Kawasaki
Irving Memis
Irving Memis
Application Number:
JP2004319589A
Publication Date:
September 03, 2008
Filing Date:
November 02, 2004
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MASCHINES CORPORATION
International Classes:
H01L23/12; H05K1/18; H01L23/498; H05K1/02; H05K1/11; H05K1/03; H05K3/46
Domestic Patent References:
| JP2252259A | ||||
| JP62134726U | ||||
| JP8046079A | ||||
| JP1312886A | ||||
| JP2001127386A | ||||
| JP7202519A | ||||
| JP2000100994A | ||||
| JP10284631A |
Attorney, Agent or Firm:
Hiroshi Sakaguchi
Yoshihiro City
Takeshi Ueno
Yoshihiro City
Takeshi Ueno
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