Title:
マイクロストリップライン構造を有する基板、マイクロストリップライン構造を有する半導体装置、及びマイクロストリップライン構造を有する基板の製造方法
Document Type and Number:
Japanese Patent JP4148069
Kind Code:
B2
Abstract:
A substrate having a microstrip line structure is provided comprising a trench provided at least in one main surface of a base body constituting the substrate having an inner surface geometry of an unbent curved surface and corresponding to the pattern of the microstrip line; a laminate film having a ground conductive layer and an insulating layer formed along the inner surface geometry of the trench; and a signal line layer constituting the microstrip line formed on the laminate film; where the signal line layer has a configuration separated for each trench.
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Inventors:
Naoto Sasaki
Application Number:
JP2003305166A
Publication Date:
September 10, 2008
Filing Date:
August 28, 2003
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L23/52; H01L21/3205; H01P3/08; H01L21/822; H01L23/12; H01L27/04; H01P11/00
Domestic Patent References:
| JP8125412A | ||||
| JP2235406A | ||||
| JP2003115557A | ||||
| JP1077002U | ||||
| JP10242599A | ||||
| JP2003234606A | ||||
| JP10290105A |
Foreign References:
| WO2002019461A1 |
Attorney, Agent or Firm:
Yoshitsuno Kakuda
Hironobu Isoyama
Hironobu Isoyama