Title:
流体噴射装置
Document Type and Number:
Japanese Patent JP4150692
Kind Code:
B2
Abstract:
In one embodiment, the present invention recites a fluid ejection device comprising a first drop ejector configured to cause fluid having a first drop weight to be ejected from the firing chamber, and includes a first heating element. A first bore, disposed within an orifice layer proximate to the first drop ejector, is associated with the first drop ejector. A second drop ejector is configured to cause fluid having a second drop weight to be ejected from the firing chamber, and includes a second heating element. A second bore, disposed within the orifice layer proximate to the second drop ejector, is associated with the second drop ejector. A voltage source, coupled in series with the first drop ejector and the second drop ejector, is configured to generate a first voltage for activating the first drop ejector individually and a second voltage for activating the first drop ejector and the second drop ejector substantially concurrently.
Inventors:
Mark H. Mackenzie
Joseph M. Togason
Joseph M. Togason
Application Number:
JP2004122686A
Publication Date:
September 17, 2008
Filing Date:
April 19, 2004
Export Citation:
Assignee:
Hewlett-Packard Development Company
International Classes:
B41J2/01; B41J2/05; B41J2/14; B41J2/15; B41J2/16; B41J2/21
Domestic Patent References:
JP6198914A | ||||
JP9254413A | ||||
JP63160853A | ||||
JP9048125A | ||||
JP6320735A | ||||
JP8048034A | ||||
JP11048482A |
Attorney, Agent or Firm:
Shoichi Okuyama
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
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