Title:
基板および半導体装置とその製造方法
Document Type and Number:
Japanese Patent JP4151136
Kind Code:
B2
Abstract:
Method of manufacturing a circuit board and semiconductor device wherein the circuit board has a plurality of wiring patterns and protrusions located on the wiring patterns, the method including simultaneously and unitarily forming the wiring patterns and protrusions, and alternatively coupling electrically the protrusions with electrodes on a semiconductor chip component when present.
Inventors:
Yagi Yuji
Takeo Anbo
Takeo Anbo
Application Number:
JP35583798A
Publication Date:
September 17, 2008
Filing Date:
December 15, 1998
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L23/12; H01L21/48; H05K1/18; H01L21/60; H01L23/498; H05K3/20; H05K3/40; H05K3/46; H05K1/09; H05K3/22; H05K3/32; H05K3/34
Domestic Patent References:
| JP61245543A | ||||
| JP9330995A | ||||
| JP2174136A | ||||
| JP3085642U | ||||
| JP3222340A | ||||
| JP3066139A | ||||
| JP7045664A | ||||
| JP10125734A | ||||
| JP5211205A | ||||
| JP5021518A | ||||
| JP11510649A |
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano