Title:
固体撮像装置、その製造方法、画像読取ユニット及び画像走査装置
Document Type and Number:
Japanese Patent JP4152062
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a small, thin, and lightweight solid-state image pickup device by face-down mounting a solid-state image pickup chip onto a glass substrate and fixing the solid-state image pickup chip and the glass substrate, with sealing of only the periphery of the solid-state image pickup chip in order to prevent water arrival at the surface of the solid-state image pickup chip. SOLUTION: This solid-state image pickup device comprises a projection 71a in a glass substrate 71 to closely attach an effective pixel area 75a of a CCD bare chip 75, bumps 74 conducting current between the CCD bare chip 75 and the wiring patterns 73 on the glass substrate 81, and a sealing mold S2 which adheres the periphery of bare chip 75 with the glass substrate 71.
Inventors:
Jun Ando
Yoshihiro Morii
Toshio Kobayashi
Yoshihiro Morii
Toshio Kobayashi
Application Number:
JP2000190575A
Publication Date:
September 17, 2008
Filing Date:
June 26, 2000
Export Citation:
Assignee:
株式会社リコー
International Classes:
H01L23/28; H01L27/14; H01L21/60; H01L23/12; H01L23/13; H04N1/028; H04N5/335; H04N5/372
Domestic Patent References:
| JP4010447A | ||||
| JP7099218A | ||||
| JP5063900A | ||||
| JP63242072A | ||||
| JP5175472A | ||||
| JP1087562U | ||||
| JP2000009206A | ||||
| JP2000009205A |
Attorney, Agent or Firm:
Hideo Takino