Title:
半導体装置
Document Type and Number:
Japanese Patent JP4154928
Kind Code:
B2
Inventors:
Kuriyama Shunkan
Application Number:
JP2002159096A
Publication Date:
September 24, 2008
Filing Date:
May 31, 2002
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/82; H01L27/04; H01L21/822
Domestic Patent References:
| JP6204340A | ||||
| JP5343702A | ||||
| JP4085948A | ||||
| JP58218139A |
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano
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