Title:
穿孔装置
Document Type and Number:
Japanese Patent JP4163429
Kind Code:
B2
More Like This:
Inventors:
Tetsuya Oketani
Moritaka Hori
Moritaka Hori
Application Number:
JP2002073329A
Publication Date:
October 08, 2008
Filing Date:
March 15, 2002
Export Citation:
Assignee:
Hori Iron Works Co., Ltd.
Howa Industry Co., Ltd.
Japan Science and Technology Agency
Howa Industry Co., Ltd.
Japan Science and Technology Agency
International Classes:
B26F1/14; B26F1/04
Domestic Patent References:
JP2001038689A | ||||
JP63189595U |
Attorney, Agent or Firm:
Yoshiki Ishida