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Title:
フレキシブル基板の検査方法
Document Type and Number:
Japanese Patent JP4167925
Kind Code:
B2
Abstract:

To provide an inspection method of a flexible board capable of facilitating a short inspection of conductor patterns formed by being arrayed in great numbers on a roll-shaped flexible film.

In this inspection method of the flexible board 20 where many conductor patterns A formed by arraying a plurality of conducting paths 23, 24 having each terminal part are formed on the roll-shaped flexible film 21, electrode lines 22 for electrolytic plating are formed respectively on both edges in the longitudinal direction of the flexible film 21, and a conductive circuit is formed by distributing mutually each conducting path of the conductor patterns A and by connecting each conducting path to each electrode line 22 for electrolytic plating through a lead for electrolytic plating extended from the terminal of each conducting path, and insulation between the electrode lines 22 for electrolytic plating on the flexible film 21 is confirmed, to thereby perform the short inspection of the conductor patterns A.

COPYRIGHT: (C)2005,JPO&NCIPI


Inventors:
Yoshiyuki Kokubun
Hiroto Komatsu
Araki Sumitaka
Application Number:
JP2003111079A
Publication Date:
October 22, 2008
Filing Date:
April 16, 2003
Export Citation:
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Assignee:
Shin-Etsu Polymer Co., Ltd.
International Classes:
G01R31/02; H05K3/00
Domestic Patent References:
JP56091277A
JP57164555A
JP59202683A
JP60130097A
JP60253252A
JP62265731A
JP3293568A
JP4109643A
JP7014889A
JP7063807A
JP9113562A
JP11233566A
Attorney, Agent or Firm:
Koichi Fujii
Kojiro Yoda