Title:
機構デバイスの製造方法及び機構デバイス
Document Type and Number:
Japanese Patent JP4174761
Kind Code:
B2
Inventors:
Naho Arima
Hiroyasu Torasawa
Hiroyasu Torasawa
Application Number:
JP2003127963A
Publication Date:
November 05, 2008
Filing Date:
May 06, 2003
Export Citation:
Assignee:
Oki Sensor Device Co., Ltd.
International Classes:
B81B3/00; H01H59/00; B81C1/00; H01H49/00
Domestic Patent References:
| JP2000057927A | ||||
| JP58201218A | ||||
| JP5002976A | ||||
| JP11232987A | ||||
| JP6197559A |
Foreign References:
| US3796976 |
Attorney, Agent or Firm:
Hisao Kobayashi
Souji Sasaki
Saburo Kimura
Noboru Omura
Souji Sasaki
Saburo Kimura
Noboru Omura